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Consumer Electronics Solution
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Product List:
- Adhesive Type: Modified Acrylic resin
- Dongyi Model: P
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PE
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified solvent based Acrylic resin
- Dongyi Model: PH
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: PL
- Application Scenario: FPC補(bǔ)強(qiáng)/PI/FR4/鋼片
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: PS
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet/Multi-layer board
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIB/DCBB
- Application Scenario: Electronic/Camera
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCWB
- Application Scenario: Light strip/backlight
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: DCIL
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DCIS
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc
- Adhesive Type: Inner Layer：Modified Epoxy resin
- Dongyi Model: DTIX
- Application Scenario: FPC Stiffener
- Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
- Adhesive Type: Inner Layer：Modified Epoxy resin + Outer Layer: Modified Acrylic resin
- Dongyi Model: DTIA
- Application Scenario: FPC Stiffener
- Introduction: Used for enhancing the insertion and removal of gold fingers and other parts in flexible circuit boards.
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DSIF/DSEB/DDIF
- Application Scenario: Car/Medical/Electronic
- Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc
- Adhesive Type: Modified Epoxy resin
- Dongyi Model: DSIF/DSEB/DDIF
- Application Scenario: Car/Medical/Electronic
- Introduction: Single panel: mainly used for laptop monitors, mobile phone antenna boards, etc Double sided panel: mainly used for electronic industry instruments, communication equipment, etc

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