- High Frequency Communication Solution
- 5G is the abbreviation of the fifth generation mobile communication technology. As an extension of 4G communication technology, it will bear an irreplaceable important mission in the process of digital transformation of the whole society. Compared to 4G, 5G has significantly improved technical indicators such as transmission rate, user experience rate, traffic density, end-to-end latency, and network energy efficiency. 5G networks have the characteristics of large bandwidth, low latency, high reliability, and wide coverage, and have broad application prospects in fields such as VR/AR, ultra high definition video, vehicle networking, drones, intelligent manufacturing, power, healthcare, smart cities, and personal consumer electronic devices. (If you have a more detailed understanding of our product solutions, please contact our website's contact information or scan our QR code or leave a message.)
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- Product List:
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Low Dk/Df Bonding Sheet
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: PL
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: Used for the bonding of medium strength board, steel sheet, FR-4 and multi-layer board inner layer in the production of flexible circuit boards
Low Dk/Df Coverlay
- Adhesive Type: Modified Polyimide resin
- Dongyi Model: DCIL
- Application Scenario: Car/Medical/Electronic
- Introduction: Used as a protective film for flexible circuit boards or laptop batteries, etc